Packaging development engineer
Core
Leading FC-FE die attach and underfill process development, optimization, and integration for semiconductor packages.
Role type
Senior IC packaging development engineer (die attach & underfill)
Builds
Flip-chip front-end packaging platforms
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
DOE design, root cause analysis (8D, 5-Why, FTA), yield improvement, material qualification, process characterization, equipment readiness, DFM validation, void control, curing profile optimization
Preferred skills
AI-based simulation tools, end-to-end flip-chip process flow knowledge
Technologies
Die attach equipment, underfill dispensing systems, CSAM inspection tools, reflow ovens
Responsibilities
Define and optimize critical process parameters for die placement, bonding, and underfill; lead DOE activities to improve yield and reliability; diagnose and resolve complex front-end process defects; qualify new materials and support NPI from concept to production; mentor junior engineers in process development and troubleshooting.
Seniority
Senior, hands-on IC
