Process Engineer (Die Attach)
Core
Support and improve the die attach process to achieve stable production, high quality, improved yield, and customer satisfaction in semiconductor manufacturing.
Role type
Process Engineer (Die Attach)
Builds
Semiconductor chips and components
Domain
Semiconductor manufacturing / Materials Engineering
Required skills
DOE, FMEA, SPC, DMAIC, 8D, failure analysis, process optimization, troubleshooting, SPC monitoring, SOP development, risk assessment, change management
Preferred skills
Mechanical/Electrical/Electronics/Material Science background, MS Excel, PowerPoint
Technologies
SPC, FMEA, DOE, 8D, DMAIC
Responsibilities
Improve and sustain die attach process performance, quality, and yield; Troubleshoot line issues and perform failure analysis; Develop and maintain process specifications, SOPs, FMEA, and control plans; Monitor process performance using SPC; Support NPI transfer and new product integration; Investigate technical issues related to materials, equipment, and process conditions; Handle customer complaints and quality concerns; Collaborate with Operations, Equipment, Quality, and Production teams.
Seniority
Mid-level, hands-on IC
