Staff Product Engineer (Adv Pkg Pathfinding), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)
Core
Lead and develop a high-performing team to drive Package and HBM Product engineering activities, focusing on sophisticated interconnect technology solutions including wafer-to-wafer bonding and electrical failure analysis.
Role type
Staff Product Engineer (Adv Pkg Pathfinding)
Builds
Next Generation HBM products
Domain
Semiconductor / High Bandwidth Memory (HBM) / Advanced Packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Advanced package process/integration knowledge, DRAM or memory expertise, electrical failure analysis (EFA), data extraction and analysis (JMP), team leadership and mentorship, project management, risk analysis and prioritization
Preferred skills
Memory testing methodology familiarity, adaptability to dynamic roles, cross-functional collaboration
Technologies
JMP, wafer-to-wafer bonding tools
Responsibilities
Collaborate with Advanced Package Technology and Test Solutions teams to enable interconnect solutions; conduct electrical failure analysis and develop DFT/characteristic data; mentor team members; make final decisions on risk analysis and project prioritization; ensure multidisciplinary development with Design, Test, and Yield Engineering teams
Seniority
Staff, hands-on IC with team leadership