Staff HBM Design Architect
Core
Design and analyze digital and analog DRAM circuits for advanced HBM products to enable breakthrough technologies in AI, ML, and high-performance computing.
Role type
Staff HBM Design Architect (IC)
Builds
Next-generation HBM memory solutions for AI, ML, and high-performance computing
Domain
Semiconductor / Memory / High-speed DRAM
Deliverable
production ML models
Required skills
CMOS circuit design, semiconductor device physics, schematic entry, circuit simulation (FineSim/HSPICE), timing/power/area/complexity trade-off analysis, architectural pathfinding
Preferred skills
3D DRAM architecture, high-speed clocking, interfaces, power delivery optimization, mixed-signal design, custom circuit design
Technologies
FineSim, HSPICE
Responsibilities
Design and analyze digital and analog DRAM circuits including simulation, optimization, and floorplanning; Evaluate full-chip or block-level functionality and develop solutions to ensure functional correctness; Analyze timing, power, area, and complexity trade-offs in high-speed DRAM or mixed-signal designs; Perform architectural pathfinding and feasibility analysis for future HBM products; Contribute to the design and optimization of memory, logic, and analog circuits
Seniority
Staff, hands-on IC