Sr. Manager, Package Design/Development Quality Assurance
Core
Lead a specialized engineering team to ensure chip-package interaction risks and reliability concerns are identified and mitigated early in Micron's advanced package technologies.
Role type
Senior Manager, Package Design/Development Quality Assurance
Builds
Advanced semiconductor package technologies for memory and storage products
Domain
Semiconductor manufacturing, specifically package assembly and reliability engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor package assembly knowledge, thermomechanical stress analysis, reliability test methods, FMEA, root cause analysis, team leadership, cross-functional influence
Preferred skills
Technical publication experience, industry practice influence, strategic technology roadmap planning
Technologies
Semiconductor packaging tools, reliability acceleration models, sampling statistics
Responsibilities
Lead DDQA strategy for new package technology introductions, drive early identification of package-level reliability risks, define characterization and reliability test strategies, mentor senior technical engineers, drive internal and external technical publications, own resource planning and efficiency improvements
Seniority
Senior, hands-on IC with people leadership
