Micron Taiwan R&D Technology and Products Group Engineer - Overseas hiring
Core
Develop, optimize, and characterize advanced packaging processes for next-generation memory products, transferring technologies from R&D to high-volume manufacturing.
Role type
R&D Engineer (Advanced Packaging)
Builds
Next-generation memory products (DRAM, NAND, NOR) and advanced packaging solutions
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Semiconductor manufacturing knowledge, process integration, data analysis, DOE, root-cause investigation, failure analysis, reliability testing
Preferred skills
3D integration, advanced substrates, bumping/interconnects, yield analysis, statistical analysis tools, Python, C/C++, Verilog
Technologies
Python, C/C++, Verilog
Responsibilities
Develop and optimize advanced packaging processes; drive process experiments and DOE; assist with failure analysis and reliability testing; own product engineering activities across the lifecycle; partner with manufacturing teams to resolve issues; monitor yield and reliability metrics
Seniority
Mid-level IC Engineer
