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[Fab15 HVM] - Dry Etch Process Equipment Engineer

Hiroshima - Fab 15, Japan💼 Full-time🗓 2026-05-24 → 2026-09-27

Core

Lead production technology improvements and management for the Dry Etch process in advanced DRAM semiconductor manufacturing.

Role type

Senior IC manufacturing process engineer (dry etch)

Builds

High-volume production of advanced DRAM memory chips

Domain

Semiconductor manufacturing / Memory and storage

Required skills

Process improvement, equipment management, yield management, project coordination, cross-functional collaboration, technical problem solving

Preferred skills

Physics/chemistry/mechanical/electrical fundamentals, new equipment introduction support, shift work coordination, international technical exchange

Technologies

Dry etch equipment, Microsoft Office (Excel, PowerPoint, Word)

Responsibilities

Improve yield and management systems, enhance productivity, support new equipment introduction and modification, identify and resolve production issues during product ramp-up, lead improvement activities with technicians and other engineers, report on daily issues and long-term projects, participate in international technical exchanges for standardization

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