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Engineering Execution Manager, HIG High Bandwidth Memory (HBM)

Fab 10A, Singapore💼 Full-time🗓 2026-04-01 → 2026-07-31

Core

Guide HBM (High Bandwidth Memory) products through concept, design, NPI, and HVM phases by facilitating cross-functional life-cycle management and driving tactical execution.

Role type

Engineering Execution Manager (Product Development)

Builds

High Bandwidth Memory (HBM) solutions for Machine Learning and AI applications

Domain

Semiconductor manufacturing / Memory and storage / AI infrastructure

Deliverable

product features

Required skills

Cross-functional team leadership, Product lifecycle management, Schedule and milestone planning, Risk analysis, Stakeholder communication, Hardware readiness planning

Preferred skills

Data analysis, Process improvement, JIRA/Confluence proficiency

Technologies

JIRA, Confluence

Responsibilities

Integrate HBM development across extended teams and partners; Partner with Technology, Design, Process, and Manufacturing teams; Collaborate with PMO to maintain development schedules; Communicate development status and priorities; Set tactical expectations across development activities; Manage development documentation and task ownership; Consolidate inputs for hardware readiness and capacity planning.

Seniority

Manager, hands-on IC

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