Principal Failure Analysis Engineer
Core
Analyzing and reporting on semiconductor products, specifically focusing on power management devices to support AI power requirements.
Role type
Principal Failure Analysis Engineer
Builds
Semiconductor products for automotive, industrial, infrastructure, and IoT industries
Domain
Semiconductor fabrication, packaging, and power management
Deliverable
physical/clinical work
Required skills
Semiconductor fabrication and packaging knowledge, non-destructive testing (Curve tracer, X-ray, SAM), image-based isolation (Photon Emission Microscopy, OBIRCh, Thermal emission), electrical schematic interpretation, bench equipment characterization, deprocessing techniques (wet chemistry, polishing, plasma), diode and transistor analysis, 10-15 years FA experience
Preferred skills
Power management product experience, electrical isolation techniques
Technologies
Curve tracer, X-ray, SAM, Photon Emission Microscopy, OBIRCh, Thermal emission
Responsibilities
Analyze and report on semiconductor product failures, utilize deprocessing techniques to isolate faults, characterize fault symptoms using bench equipment, interpret electrical schematics and layouts
Seniority
Principal, hands-on IC
