Dry Etch Principal Engineer/ MTS Lead, Process Development, Advance NAND
Core
Leading process development for next-generation NAND dry etch technology, managing R&D teams, and driving yield improvements for advanced memory products.
Role type
Principal / MTS Lead, Process Development
Builds
Next-generation NAND memory chips
Domain
Semiconductor manufacturing, specifically NAND flash memory and plasma dry etch technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Plasma Dry Etch Technology expertise, high aspect ratio etch development, hard mask requirements knowledge, process roadmap management, team leadership, performance management, vendor interaction, structured problem solving
Preferred skills
None explicitly stated as preferred, only required
Technologies
Plasma Dry Etch chambers, Wet etch, CVD, Diffusion, Metals, Lithography, CMP
Responsibilities
Manage process technology development strategy for assigned products, resolve yield and defect issues, mentor direct reports on technical and soft skills, collaborate with Manufacturing Development and High-Volume Manufacturing sites, interact with equipment and chemical vendors, recruit team members
Seniority
Principal / MTS Lead, hands-on IC with management responsibilities