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Engineer, HIG HBM Product & System Engineering (Media Health Reliability Coding)

Fab 10A, Singapore💼 Full-time🗓 2025-12-19 → 2026-09-26

Core

Develop intrinsic and extrinsic reliability test programs and flows for High Bandwidth Memory (HBM) products to ensure quality, cost, and cycle time KPIs.

Role type

Senior IC reliability test engineer (HBM)

Builds

HBM device and package qualification test flows and validation infrastructure

Domain

Semiconductor manufacturing / High Bandwidth Memory (HBM)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Python, C++, root cause analysis, statistical data analysis, CMOS technology, DRAM architecture, device physics, test verification approaches

Preferred skills

JMP, hardware specification definition, project management, process improvement

Technologies

Python, C++, JMP

Responsibilities

Writing and debugging test programs for HBM device and package qualification; Analyzing engineering data for validation and risk assessment; Defining interface hardware specifications and performing validation/debug; Making technical decisions on risk analysis and project prioritization; Identifying system and process improvements for cost and quality reduction

Seniority

Senior, hands-on IC

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