Engineer, Product & System Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Core
Drive intrinsic and extrinsic reliability test development and execution for High Bandwidth Memory (HBM) products, focusing on DPM reduction and root cause analysis for defectivity and reliability failures.
Role type
Senior IC reliability engineer (semiconductor manufacturing)
Builds
HBM DRAM and Interface die products for data center and AI applications
Domain
Semiconductor manufacturing / High Bandwidth Memory
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Reliability test flow development, Electric Failure Analysis (EFA), Physical Failure Analysis (PFA), CMOS technology knowledge, DRAM architecture understanding, Data analysis and statistics, Python scripting, JMP usage, Root cause analysis, Cross-functional collaboration
Preferred skills
Semiconductor device coursework, Circuit design experience, Product validation experience
Technologies
Python, JMP, CMOS, DRAM
Responsibilities
Define and develop reliability stress test flows and plans, Manage qualification execution progress and gating issue resolution, Drive down Extrinsic and Intrinsic Reliability (DPM) through optimized test strategies, Debug and identify root causes of qual and RMA failures via EFA and PFA, Provide recommendations to fab teams for new process conversions to improve yield and reduce cost, Manage risks associated with DPM process conversions, Collaborate with Fab, HBM Technology Development, Design, and Quality teams
Seniority
Senior, hands-on IC
