Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Core
Lead reliability test development and execution for High Bandwidth Memory (HBM) products, driving DPM reduction and root cause analysis for defectivity and intrinsic reliability issues.
Role type
Senior IC reliability engineer (semiconductor manufacturing)
Builds
HBM DRAM and Interface die products for data center and AI applications
Domain
Semiconductor manufacturing / Memory technology
Required skills
Reliability test flow development, Electric Failure Analysis (EFA), Physical Failure Analysis (PFA), Root cause analysis, Process conversion management, Risk management, Cross-functional collaboration, Project management, Technical decision making, AI/automation integration
Preferred skills
Semiconductor device experience, Circuit design, Product validation, CMOS technology, DRAM architecture, Device physics, Data analysis, Statistics, Python, JMP
Technologies
Python, JMP, EFA, PFA
Responsibilities
Define and develop reliability stress test flows and plans; Manage qualification execution and gating issue resolution; Drive extrinsic and intrinsic reliability improvements; Debug and resolve qual/RMA failures via EFA and PFA; Recommend fab process conversions for yield and cost optimization; Manage risks associated with DPM process conversions; Promote innovation in reliability workflows; Mentor team members; Lead project execution and prioritization; Collaborate with Fab, Design, and Quality teams.
Seniority
Senior, hands-on IC
