SR. HBM Stacking Process Engineer
Core
Identify, diagnose, and resolve assembly process problems for memory and storage solutions; lead continuous yield improvement and cost reduction activities.
Role type
Senior IC process engineer (semiconductor manufacturing)
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing / Memory and storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Flip chip bonding (FCB), Die bond (DB), Grinding, Design of Experiments (DOE), Yield improvement, UPH enhancement, SPC/FDC/RMS/APC support, Supplier quality management
Preferred skills
5+ years of production line or engineering experience, Master's degree or above
Technologies
SPC, FDC, RMS, APC
Responsibilities
Identify, diagnose, and resolve assembly process related problems; Coordinate and execute process, equipment, and material evaluation/optimization initiatives; Lead/participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baseline qualified for new product introduction; Support SPC/FDC/RMS/APC; Manage/audit material suppliers to achieve quality, cost, and risk management objectives
Seniority
Senior, hands-on IC
