Principal Engineer, Package Integration and Manufacturability
Core
Lead technical assessment of package risk and drive manufacturability for next-generation networking products using advanced packaging methods like chiplet integration and 2.5D interposers.
Role type
Principal Engineer, Package Integration and Manufacturability
Builds
Networking devices and modules utilizing advanced packaging and photonics technologies
Domain
Semiconductor manufacturing, Advanced Packaging, Networking Hardware
Required skills
Package technology development, System integration, 2.5D/Chiplet/Organic substrate integration, Assembly and module yield mechanics, Analytic capabilities, Cross-organizational leadership
Preferred skills
Assembly floor/foundry/OSAT experience, Co-packaged optics/photonic packaging, Design-for-manufacturability, Large high-end ASICs/multi-die modules
Technologies
Chiplet integration, 2.5D interposers, Co-packaged optics, Organic substrates, Photonic packaging
Responsibilities
Lead technical assessment of package risk across chip programs, Drive new approaches to manufacturability spanning yield and capacity, Analyze module yield mechanics and convert findings into design guidance, Evaluate emerging packaging and photonics technologies and define product requirements
Seniority
Principal, hands-on IC with strategic influence
