Package Design Methodology Engineer
Core
Design and implement VLSI tools and methodologies to construct, analyze, and validate multi-die package designs for NVIDIA's next-generation AI and HPC platforms.
Role type
Senior IC EDA tooling engineer (package design)
Builds
Production-grade EDA tooling and automated design flows for multi-die packages
Domain
Semiconductor packaging / VLSI / AI Hardware
Deliverable
production ML models | product features
Required skills
Python, C++, VLSI package design, interposer design, IC physical design, signal integrity, power delivery, parasitic extraction, data structures, algorithms, object-oriented design
Preferred skills
AI/ML techniques in engineering workflows, LLMs for code generation, ML-assisted design analysis
Technologies
Python, C++, EDA environments
Responsibilities
Design and implement VLSI tools for silicon and substrate design; Develop applications to enable project engineers with an emphasis on maintainability; Develop flows/tools to construct, analyze, and validate package designs; Optimize daily workflows of package designers
Seniority
Senior, hands-on IC
