Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging
Core
Define physical limits of chip performance and develop cross-domain solutions to overcome power, thermal, and packaging constraints in high-performance computing systems.
Role type
Senior System and Manufacturing CoDesign Architect (Power, Thermal, Packaging)
Builds
Next-generation NVIDIA GPUs and high-performance computing products
Domain
Semiconductor manufacturing, high-performance computing, power electronics, thermal management
Deliverable
production ML models | product features
Required skills
Power delivery analysis, thermal dissipation modeling, current density management, packaging technology evaluation, system-manufacturing co-design, cross-functional influence, physical-limit trend analysis
Preferred skills
AI-driven build exploration, problem-space modeling, simultaneous electrical/thermal/mechanical/manufacturing problem solving
Technologies
None explicitly listed
Responsibilities
Analyze hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands; Develop cross-domain solutions spanning silicon, packaging, firmware, and hardware co-design; Assess emerging packaging technologies for system-wide implications; Drive improvements in performance-per-watt and provisioning efficiency through system-manufacturing co-design
Seniority
Senior, hands-on IC
