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Senior PCB Engineer

China, Shenzhen💼 Full-time🗓 2026-07-21 → 2026-09-25

Core

Lead R&D and implementation of high-volume manufacturing for high layer count PCBs, defining technology roadmaps, and optimizing stack-ups for reliability and cost.

Role type

Senior IC PCB Material Science Subject Matter Expert

Builds

High-layer-count PCBs, interconnect structures, and advanced materials for AI computing products

Domain

Semiconductor hardware / Printed Circuit Board manufacturing

Deliverable

production ML models | product features | infrastructure

Required skills

PCB design and fabrication, laminate materials chemistry, HDI technology, high-speed signal integrity (25 Gbps+), supplier ecosystem management, stack-up optimization, R&D of new PCB technologies

Preferred skills

Transient Liquid Phase Sintering (TLPS) technology, Polytetrafluoropolmer (PTFE) materials, OEM system-level PCB and backplane experience

Technologies

TLPS, PTFE, HDI

Responsibilities

Lead research and development of new PCB technologies and materials, define and optimize PCB stack-ups, provide technology support to engineering and operations teams, engage with PCB supply base to qualify suppliers, develop PCB technology and material roadmaps

Seniority

Senior, hands-on IC with leadership responsibilities

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