Senior PCB Engineer
Core
Lead R&D and implementation of high-volume manufacturing for high layer count PCBs, focusing on new technologies, interconnect structures, and materials for next-generation AI products.
Role type
Senior IC PCB Material Science Subject Matter Expert
Builds
High-layer-count PCBs, advanced interconnect structures, and material roadmaps for NVIDIA AI computing products
Domain
Semiconductor manufacturing / Printed Circuit Board (PCB) materials and chemistry
Deliverable
production ML models | product features | infrastructure
Required skills
PCB design and fabrication, laminate materials chemistry, Transient Liquid Phase Sintering (TLPS) technology, Polytetrafluoropolmer (PTFE) materials, HDI processes, high-layer-count stack-up optimization, signal integrity analysis for high-speed designs (25 Gbps+), supplier ecosystem management
Preferred skills
OEM system-level PCB and backplane experience, experience with high-volume manufacturing processes
Technologies
TLPS, PTFE, HDI, 25 Gbps+ signal integrity protocols
Responsibilities
Lead R&D of new PCB technologies and materials, define and optimize PCB stack-ups for reliability and cost, provide technical support to engineering and design teams, manage relationships with PCB manufacturers and laminate suppliers, qualify suppliers for new technologies
Seniority
Senior, hands-on IC with leadership responsibilities
