Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)
Core
Lead a high-performing team driving Media Health Manufacturing and activities for Micron's latest High Bandwidth Memory (HBM) products, focusing on DRAM, Interface die, and stacked products.
Role type
Principal Engineer, HBM Product System Engineering (Media Health Manufacturing)
Builds
Next-generation HBM products for data centers, AI, and high-performance computing
Domain
Semiconductor manufacturing, High Bandwidth Memory (HBM), DRAM, Interface die, Stacked products
Required skills
Semiconductor product engineering, Manufacturing test flow development, Circuit debug and analysis, Yield improvement strategies, DFT strategy, Cross-functional collaboration, Project management, Root cause analysis, Statistics and data analysis, Scripting
Preferred skills
Leadership and team mentorship, Innovation in test coverage and reliability, AI tool utilization for productivity
Technologies
CAD tools, Verilog simulations, Manufacturing test flow tools, DFT tools
Responsibilities
Lead manufacturing test flow development and validation; Improve device/stacked yield through circuit debug and test coverage optimization; Support new product design validation using simulations; Resolve yield-related issues and manufacturing test flow problems; Mentor team members and drive technical innovation; Make technical decisions on risk analysis and project prioritization.
Seniority
Principal, hands-on IC with leadership responsibilities