HBM PYE Product Development Failure Analysis Engineer
Core
Perform electrical, physical, and statistical failure analysis to identify root causes of defects in next-generation HBM (High Bandwidth Memory) devices from design through mass production.
Role type
Senior IC semiconductor failure analysis engineer (HBM)
Builds
Next-generation HBM memory products for data centers and AI applications
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM)
Deliverable
production ML models
Required skills
electrical failure analysis, physical failure analysis, statistical analysis, root cause analysis, Python programming, semiconductor device physics, VLSI knowledge, data analytics, AI tool usage
Preferred skills
JMP statistical software, Generative AI tools (Copilot, Claude), large-scale data analysis, yield improvement strategies, cross-functional technical leadership
Technologies
Python, JMP, Copilot, Claude, AI/ML frameworks
Responsibilities
Characterize component- and system-level failures using electrical and physical techniques; Analyze data to resolve fabrication, assembly, and test-related issues; Collaborate with Product, Process, Test, and Manufacturing teams to drive corrective actions; Support rapid production ramp and product qualification; Apply AI-enabled tools to enhance failure detection and reliability learning cycles.
Seniority
Entry to Staff level (2+ years to 7+ years experience)