ENGINEER, HBM PROCESS
Core
Identify, diagnose, and resolve assembly process problems while optimizing process steps for new product introductions.
Role type
Senior IC manufacturing process engineer
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing (memory and storage)
Required skills
Assembly process troubleshooting, process optimization, yield improvement, cost reduction, SPC/FDC/RMS/APC support, supplier management, audit support, AI tool utilization for process improvement
Preferred skills
Site-to-site portability experience, new product introduction (NPI) validation
Technologies
SPC, FDC, RMS, APC, AI tools
Responsibilities
Coordinate and execute process, equipment, and material evaluation/optimization initiatives; Lead or participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baselines including new tools and materials for NPI; Manage and audit material suppliers for quality, cost, and risk objectives; Support internal and external audits using AI tools. (via careerplan.io/jobs/JR113678-engineer-hbm-process-at-micron)
Seniority
Senior, hands-on IC