Senior/Staff Engineer, DEMQRA HBM RMA
Core
Oversee failure analysis of customer-returned HBM products, identify root causes, and establish containment plans for DRAM components.
Role type
Senior IC reliability engineer (HBM/DRAM)
Builds
Failure analysis reports, root cause identification, and corrective action plans for returned memory modules
Domain
Semiconductor manufacturing and reliability engineering
Required skills
DRAM operation knowledge, semiconductor device physics, electrical failure analysis (EFA), physical failure analysis (PFA), root cause analysis, containment planning, cross-functional collaboration
Preferred skills
System-level debug experience (CPU/DRAM/OEM), proficiency with AI coding tools (Copilot, Claude Code)
Technologies
ATE, bench-level testing, system-level testing, component testing, module testing
Responsibilities
Engage customers to clarify failure conditions, coordinate detailed electrical and physical failure analysis, summarize findings and generate FA reports, drive corrective actions with engineering teams, maintain knowledge of DRAM process technologies and datasheet specifications
Seniority
Senior, hands-on IC