SR ENGINEER, TDT DRAM PI
Core
Identify, diagnose, and resolve assembly process problems while leading yield improvement and cost reduction initiatives for DRAM manufacturing.
Role type
Senior IC Process Integration Engineer (DRAM)
Builds
High-performance DRAM memory products
Domain
Semiconductor manufacturing / Memory and storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Assembly process troubleshooting, Process optimization, Yield improvement, Cost reduction, SPC/FDC/RMS/APC support, Supplier quality management, Site-to-site portability, Project management, AI-assisted data analysis, Proactive problem anticipation
Preferred skills
Experience with AI-enabled workflow tools (Claude, Copilot)
Technologies
SPC, FDC, RMS, APC
Responsibilities
Coordinate and execute process, equipment, and material evaluation/optimization; Validate and fan out new process baselines for new product introduction; Manage and audit material suppliers for quality, cost, and risk objectives; Support internal and external audits.
Seniority
Senior, hands-on IC