Process Integration Lead
Core
Lead day-to-day Process Integration execution for assigned DRAM modules, owning yield ramp, stability, and integration readiness during technology transfer, pilot, and early HVM phases.
Role type
Senior Process Integration Lead (DRAM)
Builds
DRAM memory and storage solutions
Domain
Semiconductor manufacturing (Fab)
Required skills
Process Integration (PI), Yield Engineering, Root Cause Analysis (DOE, SPC/FDC, FMEA, 8D), Technology Transfer, Team Management, Cross-functional Collaboration, Process Control, Reliability Engineering
Preferred skills
Advanced Technology & Engineering (ATE) experience, New Product Introduction (NPI), International assignments
Technologies
DRAM modules, CMOS, Transistor operations, SPC/FDC, DOE, FMEA, 8D
Responsibilities
Lead PI execution and readiness for assigned DRAM modules; Drive root cause investigations and yield improvement; Manage and develop a team of PI engineers; Partner across Manufacturing, Equipment, Yield, Device, TD, Quality, and Design to resolve issues; Ensure process margin, manufacturability, and reliability requirements are met.
Seniority
Senior, hands-on IC with people leadership