Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) Engineer/Senior Engineer
Core
Lead initiatives to improve process capability, maximize bits per wafer, and accelerate yield improvement through data-driven innovation in semiconductor manufacturing.
Role type
Senior Product Integration Engineer (Data Analytics & Process Optimization)
Builds
Scalable data analytics solutions and predictive process optimization models for semiconductor manufacturing.
Domain
Semiconductor manufacturing (Front-end/Back-end processes, DRAM, HBM, advanced packaging)
Deliverable
production ML models
Required skills
Data analysis (JMP, Python, Y3), Semiconductor manufacturing processes, Root cause analysis, Predictive process optimization, Cross-functional collaboration
Preferred skills
Statistical modeling, Machine learning, AI, Yield/quality improvement strategies, DRAM/HBM/Advanced packaging knowledge
Technologies
JMP, Python, Y3
Responsibilities
Analyze manufacturing/test/design data to increase high-value bits per wafer; Develop models to evaluate equipment and process performance; Partner with process/equipment/data science teams to prototype solutions; Deploy Best Known Methods (BKMs) into production; Lead multi-functional projects across global sites; Improve business processes and operational workflows.
Seniority
Senior, hands-on IC
