Product Integration Lead, HIG High Bandwidth Memory
Core
Lead integration of High Bandwidth Memory (HBM) products into end-system requirements, driving development priorities and resolving technical challenges to meet customer demands.
Role type
Senior Product Integration Lead (HBM)
Builds
HBM product solutions for end-systems (AI, data center, mobile)
Domain
Semiconductor / Memory & Storage / High Bandwidth Memory
Deliverable
production ML models | product features
Required skills
HBM product development, silicon-system alignment, change management, risk assessment, technical issue triage, qualification definition, stakeholder collaboration
Preferred skills
DRAM/HBM device design knowledge, Python/Java/C/VB programming, Tableau/PowerBI
Technologies
Success Criteria Document (SCD), Change Control Board, AI-driven workflow tools
Responsibilities
Manage technical inputs and drive silicon-system alignment on requirements; Collaborate with Architecture, Systems Engineering, and Quality teams to resolve gaps; Manage HBM sample delivery and risk assessment; Lead Triage Team for system-chip feature interactions; Manage Qualification Definition and Change Control Board; Communicate priorities to maintain focus on system specs
Seniority
Senior, hands-on IC