Principal Signal Integrity Engineer
Core
Principal Signal Integrity Engineer developing energy-efficient bandwidth solutions for high-speed memory and die-to-die interfaces via original analysis, modeling, and simulation.
Role type
Principal Signal Integrity Engineer (Pathfinding/Advanced Development)
Builds
Forward-looking interconnect models, substrate/packaging evaluations, link budgets, and design rules for high-speed memory and die-to-die interfaces.
Domain
Semiconductor industry, high-speed interface technologies, signal integrity, electromagnetic analysis
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
electromagnetic and transmission line theory, time- and frequency-domain simulation, electromagnetic field solvers, hardware measurement tools, cross-disciplinary collaboration, analytical decision-making
Preferred skills
memory I/O architectures, advanced packaging technologies (2.5D/3D, embedded die), post-silicon characterization, optical link modeling, AI-based workflow methods
Technologies
ADS, HSPICE, SPECTRE, Q3D, SIWAVE, HFSS, oscilloscopes, TDR, VNA
Responsibilities
Generate and validate interconnect models for packages and substrates; lead SI assessment of next-generation substrate and packaging technologies; drive SI analysis and I/O + channel co-optimization during feasibility studies; develop progressive package and system-level design rules; define forward-looking link budgets and sim-to-silicon correlation methodologies; collaborate across disciplines to translate SI findings into actionable guidance; author analysis reports, modeling methodology documents, and design rule specifications
Seniority
Principal, hands-on IC with strategic ownership
