Senior Engineer, PD SG, Dry Etch, NAND
Core
Develop and deploy next-generation NAND Dry Etch process technologies for 3D NAND devices, utilizing AI to enable production-worthy solutions.
Role type
Senior IC process development engineer (semiconductor dry etch)
Builds
3D NAND memory devices and storage products
Domain
Semiconductor manufacturing / Memory and storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Dry etch process development, Design of Experiments (DOE), statistics, data analysis, 3D NAND technology, AI proficiency, cross-functional collaboration
Preferred skills
Strong publication/patent record, technology development crafting, process simplification
Technologies
AI tools, analysis software tools
Responsibilities
Rapid deployment of new NAND Dry Etch process technologies, drive development efforts prior to device ramp, define actions to achieve performance within timelines, examine Dry Etch process windows and refine recipes, troubleshoot processes to drive yield and quality improvement, identify areas for improvement and collaborate with Fabs, integrate best-known manufacturing methods into early development phases
Seniority
Senior, hands-on IC