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Intern - Process Development Engineer, 3D DRAM CMP

Boise, ID - Main Site💼 Internship🗓 2026-08-10 → 2026-10-07

Core

Develop and optimize Chemical Mechanical Planarization (CMP) processes for next-generation 3D DRAM manufacturing.

Role type

Intern, Process Development Engineer (Semiconductor Manufacturing)

Builds

Advanced DRAM memory products

Domain

Semiconductor manufacturing / Materials Science

Deliverable

production ML models | product features

Required skills

Experimental design, data analysis, root-cause analysis, failure-mode methodologies, statistical process control (SPC), design of experiments (DOE), Python/MATLAB/JMP/R scripting, AI-assisted data analysis

Preferred skills

Semiconductor processing experience, materials characterization, model-based problem-solving, AI workflow automation

Responsibilities

Develop and evaluate CMP processes for physical and electrical performance; partner with multi-functional teams to implement process improvements; conduct fundamental research and experimental studies; analyze manufacturing data using AI tools; present technical contributions and results.

Seniority

Intern