CareerPlan

Intern - Process Development Engineer, 3D DRAM Dry Etch

Boise, Idaho, United States of AmericaInternship2026-08-04 → 2026-10-23

Core

Develop and optimize advanced semiconductor dry etch processes for next-generation DRAM technologies through experimentation and data analysis.

Role type

Intern, Process Development Engineer (Semiconductor)

Builds

Advanced plasma etch technologies for future memory scaling and device performance

Domain

Semiconductor manufacturing / Memory (DRAM)

Required skills

dry etch semiconductor processing, plasma physics, experimental design, statistical analysis, root cause analysis

Preferred skills

process characterization, programming/scripting, data analytics, AI-enabled analysis, statistical software (Python, MATLAB, JMP)

Technologies

Python, MATLAB, JMP

Responsibilities

Research and develop innovative solutions for next-generation memory technologies; Design, implement, and analyze experiments to improve etch process performance; Perform statistical analysis of technology development and pilot manufacturing data; Collaborate with process, equipment, and integration engineering teams; Apply AI-enabled analysis tools or programming solutions to improve engineering efficiency

Seniority

Intern