CareerPlan

Intern - Process Development Engineer, Planar DRAM CMP

Boise, Idaho, United States of AmericaInternship2026-08-13 → 2026-11-10

Core

Develop and optimize Chemical Mechanical Polishing (CMP) processes and chemistries for next-generation semiconductor technology nodes using experimentation, data analysis, and AI-enabled tools.

Role type

Intern, Process Development Engineer (Semiconductor Manufacturing)

Builds

New CMP processes and process chemistries for future integrated circuit manufacturing

Domain

Semiconductor manufacturing / Chemical Engineering

Deliverable

production ML models

Required skills

Chemical Engineering, Chemistry, Materials Science, Surface Chemistry, Electrochemistry, Data Analysis, Experimental Design, Technical Reporting, AI Tool Usage

Preferred skills

Integrated Circuit Processing, CMP Equipment, Generative AI, Large Language Models (LLMs), Research Environment Experience

Technologies

AI-enabled tools, Microsoft Copilot, LLMs

Responsibilities

Collaborate with engineering teams to evaluate CMP processes and hardware platforms; Conduct fundamental research and process characterization; Assist with projects on process capability, productivity, and contamination control; Utilize AI tools to analyze experimental data and improve workflow; Prepare and present technical reports and recommendations.

Seniority

Intern