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Intern – Process Development Engineer, 3D DRAM Wet Etch

Boise, ID - Main Site💼 Internship🗓 2026-07-24 → 2026-09-25

Core

Develop and optimize wet process technologies for 3D DRAM to meet product physical and electrical performance requirements.

Role type

Process Development Engineering Intern (Semiconductor Manufacturing)

Builds

Next-generation 3D DRAM memory products

Domain

Semiconductor manufacturing / Memory technology

Deliverable

production ML models | product features

Required skills

experimental design, data analysis, root-cause analysis, statistical methods, AI/data-driven problem solving

Preferred skills

statistical process control (SPC), AI-enabled tools for engineering workflows, programming/scripting for data analysis, semiconductor process expertise, large dataset management

Technologies

AI tools, statistical software, semiconductor process equipment

Responsibilities

Develop and optimize wet process technologies; Collaborate with multi-functional teams to implement process improvements; Perform root-cause analysis and failure-mode investigations; Analyze experimental and manufacturing data using statistical methods; Apply AI and data-driven approaches to enhance process analysis

Seniority

Intern

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