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Intern - Process Development Engineer, 3D DRAM Dry Etch

Boise, ID - Main Site💼 Internship🗓 2026-08-04 → 2026-09-26

Core

Develop and optimize advanced plasma etch technologies for next-generation DRAM memory scaling and device performance.

Role type

Intern, Process Development Engineer (Semiconductor Dry Etch)

Builds

Advanced semiconductor etch processes for future memory technologies

Domain

Semiconductor manufacturing / Memory storage

Deliverable

production ML models | product features | research

Required skills

Dry etch semiconductor processing, plasma physics, experimental design, statistical analysis, data analysis

Preferred skills

Semiconductor process development, process characterization, programming/scripting, AI-enabled analysis, root-cause analysis, failure analysis

Technologies

Python, MATLAB, JMP

Responsibilities

Research and develop innovative solutions for next-generation memory technologies; Design, implement, and analyze experiments to improve etch process performance; Perform statistical analysis of technology development and pilot manufacturing data; Collaborate with process, equipment, and integration engineering teams; Apply AI-enabled analysis tools or programming solutions to improve engineering efficiency.

Seniority

Intern, academic program

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