HBM Advanced Package Sr. Process / Equipment Engineer
Core
Sr. Process/Equipment Engineer responsible for wafer bonding/debonding processes, tool maintenance, and process optimization in advanced semiconductor packaging.
Role type
Senior IC process engineer (advanced packaging)
Builds
High-performance memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features
Required skills
Wafer bonding, debonding, coating, lithography, thin film, semiconductor equipment parameter setup, process maintenance, abnormal analysis, AI/data analytics for process monitoring and predictive maintenance
Preferred skills
Experience in advanced packaging processes, 3+ years in production line
Technologies
Semiconductor equipment, AI tools, data analytics platforms
Responsibilities
Account for and sustain bond process, backup debond area process maintenance, establish and improve process conditions, upgrade tool capability, set up process parameters, evaluate new equipment/materials, perform abnormal analysis and improvement
Seniority
Senior, hands-on IC
