HBM Advanced Package Sr. Process / Equipment Engineer
Core
Sr. Process/Equipment Engineer responsible for wafer bonding, debonding, coating, lithography, thin film, and advanced packaging processes in semiconductor manufacturing.
Role type
Senior IC process engineer (advanced packaging)
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models
Required skills
Wafer bonding, debonding, coating, lithography, thin film, advanced packaging processes, process maintenance, semiconductor equipment parameter setup, abnormal analysis, AI and data analytics for process monitoring and optimization
Preferred skills
Experience in production line, process maintain experience, Bachelor degree or above
Technologies
Semiconductor equipment, AI tools, data analytics tools
Responsibilities
Account for and sustain Bond process, backup Debond area process maintenance, establish and improve process condition and technology, upgrade tool capability, set up process parameters, evaluate new equipment/materials, perform abnormal analysis and improvement, leverage AI/data analytics for predictive maintenance and optimization