HBM Advanced Package Process / Equipment Engineer
Core
Establish and improve HBM bonding/debonding processes, set up semiconductor equipment parameters, and leverage AI/data analytics for predictive maintenance and process optimization.
Role type
Senior IC process/equipment engineer (semiconductor manufacturing)
Builds
High-performance DRAM, NAND, and NOR memory and storage products (HBM)
Domain
Semiconductor manufacturing / Memory and storage
Deliverable
production ML models | product features
Required skills
Bond process management, Debond area process maintenance, Semiconductor equipment parameter setup, Process condition improvement, New equipment/material evaluation, Abnormal analysis, AI and data analytics tools for process monitoring
Preferred skills
3+ years production line experience, Process maintain experience
Technologies
Semiconductor equipment, AI tools, Data analytics tools
Responsibilities
Account for and sustain Bond process, Backup for Debond area process basic maintenance, Establish and improve process condition and technology, Upgrade tool capability and improve product quality, Set up process parameters for semiconductor equipment, Abnormal analysis and improvement, Leverage AI and data analytics for predictive maintenance and process optimization
Seniority
Mid-level, hands-on IC