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[Fab15 HVM] - Dry Etch Process Equipment Engineer

Hiroshima - Fab 15, Japan💼 Full-time🗓 2026-07-20 → 2026-07-31

Core

Drive yield improvement, productivity, and quality in high-volume manufacturing of advanced DRAM semiconductors using dry etch processes, leveraging AI and data analysis for process optimization and decision-making.

Role type

Senior IC manufacturing process engineer (dry etch)

Builds

High-performance DRAM memory chips for data centers, AI, 5G, and mobile applications

Domain

Semiconductor manufacturing / Advanced DRAM production

Deliverable

production ML models | product features

Required skills

Dry etch process expertise, yield management, production planning, cross-functional project leadership, data-driven decision making, AI tool utilization, problem-solving, stakeholder communication

Preferred skills

Background in physics, chemistry, mechanical, or electrical engineering, experience with new equipment introduction and modification

Technologies

AI-enabled analytics tools, Microsoft Office (Excel, PowerPoint, Word)

Responsibilities

Lead cross-functional projects to improve yield, quality, and productivity in the dry etch group; support introduction and modification of new advanced equipment; collaborate with equipment engineers, process engineers, and technicians; report on daily issues and long-term projects to leadership and stakeholders; participate in global technical exchanges and standardization efforts

Seniority

Senior, hands-on IC

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