PDE CEM Engineer
Core
Lead development, optimization, and control of semiconductor packaging assembly processes to meet NPI schedules, driving yield, quality, and reliability improvements.
Role type
Senior IC process engineer (semiconductor packaging)
Builds
High-volume memory and storage packaging solutions
Domain
Semiconductor manufacturing / backend assembly
Deliverable
production ML models | product features
Required skills
DOE, SPC, Six Sigma, FMEA, RCA, statistical analysis (JMP), process capability analysis, yield management, cross-functional leadership
Preferred skills
AI/ML fundamentals, Python, SQL, Industry 4.0 concepts, predictive process control
Technologies
MES, JMP, Python, SQL
Responsibilities
Own Process of Record (POR) and process windows; drive NPI qualification; apply DOE and SPC to optimize processes; lead root cause analysis and corrective actions; leverage AI/ML for yield prediction and anomaly detection; evaluate new materials and equipment; coach process teams.
Seniority
Senior, hands-on IC
