ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION
Core
Develop and lead integration processes for highly complex HBM package development from conceptual phase to high-volume production, focusing on yield and quality improvement.
Role type
Senior Process Integration Engineer (Advanced Packaging)
Builds
High-bandwidth memory (HBM) products for data center and AI applications
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features
Required skills
HBM package structure and process flow knowledge, integrated failure mode analysis, process change management, model-based problem solving, Design of Experiments (DOE) establishment and analysis
Preferred skills
AI agent development for yield reporting automation
Technologies
JMP, XMoba, Yield cube3, Klayout, SPC
Responsibilities
Develop unit processes meeting product specs for HBM products, perform real-time yield and defect analysis, control inline WIP, drive automation including AI agents for routine yield reporting
Seniority
Senior, hands-on IC
