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Director, Custom HBM Design and Architecture

2 Locations💼 Full-time💰 $199,000–$199,000🗓 2026-06-23 → 2026-07-31

Core

Lead a team in designing, integrating, and delivering next-generation HBM SoC logic die for AI/ML applications.

Role type

Director, Custom HBM Design and Architecture

Builds

Next-generation HBM SoC logic die for AI/ML applications

Domain

Semiconductor / High Bandwidth Memory (HBM) / AI/ML Hardware

Deliverable

production ML models

Required skills

SoC design leadership, RTL design, SoC integration, RTL-to-GDS flows, IP subsystem integration, SystemVerilog, Python, TCL, pre-silicon validation, hardware emulation, post-silicon debug

Preferred skills

DRAM/HBM systems knowledge, JEDEC standards, global engineering team management, tape-out program leadership

Technologies

SystemVerilog, Python, TCL, TSMC process nodes

Responsibilities

Analyze hardware/software interaction to identify AI/ML workload bottlenecks; Drive future HBM architecture and proof of concept designs; Translate architectural specs into RTL implementations; Own RTL design deliverables from development to silicon bring-up; Drive trade-offs across performance, power, area, schedule, and risk; Build and scale high-performing RTL design teams

Seniority

Director, technical leadership & team management

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