PDE CEM Engineer
Core
Lead New Product Introduction (NPI) builds, pilot runs, and process qualification for High Bandwidth Memory (HBM) products, ensuring stable transfer to high-volume manufacturing.
Role type
Senior IC Process Engineer (NPI)
Builds
HBM memory and storage solutions
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE design and execution, Failure analysis (PFA/EFA), Statistical process control (SPC), Root cause analysis, Process optimization, Yield improvement, FMEA, Technology transfer
Preferred skills
HBM stack-up knowledge, Advanced packaging processes (bonding, curing), Equipment calibration, Data analysis (FDC)
Technologies
FDC, SPC, BOP, SOP, OCAP, ET, TIQ
Responsibilities
Lead NPI builds and pilot runs for HBM products; Develop and optimize assembly processes (stacking, bonding, cure); Drive yield improvement through data analysis and failure analysis; Define and validate tooling requirements and configurations; Partner with APTD, Manufacturing, and Quality teams; Own NPI documentation (BOP, SOP, OCAP) and ensure release readiness; Perform risk assessment (FMEA) and implement control plans; Lead technology transfer from NPI to production teams; Drive continuous improvement projects for yield and cycle time.
Seniority
Senior, hands-on IC
