Product Integration Engineer
Core
Lead process integration for advanced semiconductor package architectures, driving development builds, qualification, and high-volume manufacturing readiness.
Role type
Senior IC process integration engineer (advanced packaging)
Builds
Advanced memory and storage packages (HBM, 3DS, flip chip, TSV) for data center and AI applications
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process integration, yield analysis, defect mechanism analysis, NPI phase gate execution, FMEA development, root cause analysis, DOE planning, DFM collaboration
Preferred skills
Multi-site collaboration, continuous improvement methodologies, AI tool integration for process optimization
Technologies
HBM, 3DS, flip chip, TSV, DOE tools, FMEA frameworks
Responsibilities
Lead process integration for new package architectures, drive qualification builds and readiness for product release, optimize yield and process stability for high-volume manufacturing, lead cross-functional program execution across development and manufacturing sites, execute continuous improvement activities for process maturity
Seniority
Senior, hands-on IC
