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HBM EQUIPMENT ENGINEER

Taichung - MTB, Taiwan💼 Full-time🗓 2026-06-09 → 2026-07-30

Core

Evaluate and improve manufacturing processes, equipment, and materials for HBM assembly.

Role type

HBM Equipment Engineer

Builds

High-bandwidth memory (HBM) memory and storage solutions

Domain

Semiconductor manufacturing / Memory and storage

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

thinning or dicing tool handling, tool installation and setup, FDC analysis, DOE/FMEA/OCAP/8D/SPC techniques, equipment component design, supplier relationship management, process variable identification

Preferred skills

tool signal understanding (SVID, CEID, ECID), new tooling material evaluation for cost saving

Technologies

SVID, CEID, ECID, FDC

Responsibilities

Evaluate and improve assigned assembly manufacturing processes, materials, and/or equipment; Optimize process and equipment variables; Identify all process variables; Perform containment of process and equipment deviations; Determine root cause; Implement corrective action; Design equipment components; Build and maintain effective relationships with suppliers; Evaluate Future Process, Equipment, Material Technologies

Seniority

Mid-level, hands-on IC

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