Senior Engineer, PD SG, Dry Etch, NAND
Core
Developing next-generation 3D NAND process technologies and dry etch recipes to enable seamless delivery of high-performance memory solutions.
Role type
Senior IC process development engineer (semiconductor manufacturing)
Builds
Production-worthy NAND memory devices and process technologies
Domain
Semiconductor manufacturing / 3D NAND / Dry Etch
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Dry etch process development, 3D NAND technology, Design of Experiments (DOE), statistics, data analysis, cross-functional collaboration, troubleshooting, process simplification, AI-driven workflow optimization
Preferred skills
Strong publication/patent record, technology development focus, relationship building with vendors
Technologies
Dry etch tools, analysis software tools, AI-driven solutions
Responsibilities
Rapid deployment of new NAND process technologies, define actions to achieve performance targets within timelines, examine and refine dry etch process windows and recipes, troubleshoot processes to drive yield and quality improvement, identify and own areas for process improvement, integrate best-known manufacturing methods into early development phases
Seniority
Senior, hands-on IC