TD NAND CMOS Process Integration, Principal/MTS Engineer Lead
Core
Leading a team to design, develop, integrate, and implement CMOS device and process solutions to improve NAND product yield, reliability, and quality.
Role type
Principal/MTS Engineer Lead (Process Integration)
Builds
NAND flash memory modules and devices
Domain
Semiconductor manufacturing, NAND flash technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMOS integration, device physics, layout architecture, inline and electrical metrics, nonvolatile memory process flow, yield and reliability analysis, team management, cross-functional collaboration, strategic project prioritization, process optimization, new module development, quality experiment design, manufacturing transfer support, AI tool integration
Preferred skills
PhD in Electrical Engineering/Microelectronics/Material Science, prior DRAM research and development experience, TD (Technology Development) exposure, experience with alpha and derivative product integration
Technologies
NAND process flow, CMOS device structures, inline metrology tools, electrical characterization software, AI-assisted analysis tools
Responsibilities
Hire, develop, and manage a team of CMOS device and integration engineers; define and develop NAND CMOS to meet technology and electrical specifications; set priorities for the technology program and garner support; monitor yield and product performance metrics; drive cross-functional teams to address module performance deficiencies; design and implement quality experiments to improve module performance; support the transfer of structure/CMOS fundamentals into manufacturing; initiate and set up systems to enable effective engagement within the team and partners; regularly update senior management on team project status; lead quarterly yield summits and program reviews.
Seniority
Principal, hands-on IC with team leadership
