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Dry Etch Principal Process Development Engineer

Boise, ID - Main Site💼 Full-time🗓 2026-06-07 → 2026-07-31

Core

Develop and refine plasma dry etch processes for advanced DRAM structures, guiding ideas from conception through process development to integration in production facilities.

Role type

Principal Process Development Engineer (Dry Etch)

Builds

Advanced DRAM memory parts and 3D device structures

Domain

Semiconductor manufacturing / Memory and storage solutions

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Plasma etch fundamentals, reactor operation, experimental design, data analysis, root cause and failure mode analysis, process transfer to manufacturing

Preferred skills

Advanced DRAM or 3D device structures experience, vendor relationship management, yield improvement, SPC

Technologies

Plasma reactors, SPC tools

Responsibilities

Develop and refine dry etch processes for advanced DRAM structures; Collaborate with process integration and other process development teams to develop innovative new solutions; Perform root cause and failure mode analysis on process and hardware limitations; Design experiments and analyze data to improve capability and yield; Support process transfer from development to manufacturing

Seniority

Principal, hands-on IC with strategic roadmap influence

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