Module Engineer On-Shift (MEOS) – Day Shift (7)
Core
Provide real-time factory support for equipment, process, and product issues to ensure continuous lot movement in substrate packaging manufacturing.
Role type
Module Engineer On-Shift (MEOS)
Builds
Substrate packaging manufacturing processes
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Metrology tools, Exposure lithography tools, Laser tools, Statistical Process Control (SPC), Tool troubleshooting, Error recovery, Lot disposition, Non-standard procedures, Inspection and imaging
Preferred skills
Semiconductor packaging manufacturing experience, Tool recipe creation
Technologies
Metrology tools, Lithography tools, Laser tools
Responsibilities
Provide hands-on real-time support for equipment and process issues, Execute non-standard procedures and perform inspection/imaging, Write and update specifications and RFCs, Communicate shift pass-downs and align priorities with management, Respond to process issues and manage lot disposition, Perform ad-hoc duties within the functional area
Seniority
Mid-level, hands-on IC