Defect Characterization Low Yield Analysis Engineer
Core
Lead root cause identification and yield improvement strategies for advanced packaging assembly and substrate technology development programs.
Role type
Senior IC low yield analysis engineer (defect characterization)
Builds
Yield improvement strategies and defect characterization methodologies for advanced packaging and substrate programs
Domain
Semiconductor manufacturing, advanced packaging, failure analysis
Required skills
Root cause analysis, statistical methods, coding tools, advanced analytical techniques, cross-functional collaboration, technical leadership, data set consolidation, corrective action implementation, equipment strategy
Preferred skills
Hands-on failure analysis and characterization techniques, mechanical cross-sectioning, ion milling, FIB, statistical analysis tools, mentoring, new characterization technique development
Technologies
Optical Microscopy, SEM/EDS, EBSD, CSAM, FTIR, Raman, FIB, ion milling, Python, JMP, JSL, SQL, TEM, XRD
Responsibilities
Lead end-to-end investigations to identify and resolve complex yield, defect, and quality issues; Define characterization strategies and root cause methodologies; Correlate characterization results with electrical data and process history; Consolidate and analyze large data sets to identify yield limiters; Develop tools and dashboards to improve analysis efficiency; Drive corrective actions and process improvements; Mentor engineers and technicians; Support future capability development through equipment strategy and roadmap planning
Seniority
Senior, hands-on IC