Module Engineering PhD Intern
Core
Conduct fundamental research and experimentation to characterize materials, identify failure modes, and develop assembly processes for next-generation packaging platforms.
Role type
PhD intern in materials science and assembly technology
Builds
Assembly processes and equipment for Intel's next-generation packaging platform
Domain
Semiconductor manufacturing / Materials Science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Fundamental research and experimentation, Material characterization, Structure-property-performance analysis, Supplier collaboration, Process development, Test vehicle evaluation
Preferred skills
Technical problem-solving, Presentation skills, Fast learning, Cross-team collaboration
Technologies
Assembly processes, Test vehicles
Responsibilities
Characterize materials and assess feasibility for product applications, Develop material formulations meeting quality and cost requirements, Partner with engineering teams to implement material technologies, Design and develop assembly processes and equipment
Seniority
Intern
